Welcome to Laser Metrology for Precision Measurement and Inspection in Industry (LMPMI) 2014!

Laser Metrology for Precision Measurement and Inspection in Industry (LMPMI)September 2nd – 5th, 2014, EPOCHAL TSUKUBA Tsukuba, Japan


Symposium schedule

Topics of the conference includes

Presentation Program

Download Presentation Program

Presentation guideline

Oral Presentation
  • (1)Time allotted for an oral presentation is 15 min in total including discussion.
  • (2)Time allotted for a session keynote presentation is 30 min in total including discussion.
  • (3)Please confirm the session room and the time slot allotted for.
  • (4)Please show up in the session room at least 15 min before the session.
  • (5)All session rooms for Oral Presentations equip PC and LCD projector.
  • (6)Authors are the responsible and required to verify their presentation file on the PC in the session room. Load the presentation file into the PC, and check the compatibility during the break before the session.
  • (7)Authors are also allowed to use their own PC for the presentation. Provided projector has D-SUB 25 pin 15 pin connector. Please do not forget to take appropriate connector. (Some of the PCs don’t have D-SUB connector, and transfer cable is required. We don’t prepare any transfer cable)
  • (8)The operation system of the PC is Microsoft Windows7 Professional, and the acceptable presentation file formats are Microsoft PowerPoint and Adobe PDF.
  • (9)Please use conventional fonts typically installed in Windows7. Prepare the PDF file with font import option be active when authors are going to use PDF format.
Poster Session
  • (1)Poster Session is held in Multi-Purpose Hall.
  • (2)A presentation panel with the dimension of 2.0 m in width and 0.9 m in height will be provided for each presentation.
  • (3)Please use thumb tacks which will be provided at the poster panel by the organizer.
  • (4)Authors are highly requested to put up their posters from September 3 (poster area will open from 10:40AM), and to keep them at least to 16:00, September 4.
  • (5)Core time of the poster presentations is 15:00-16:00, September 4.
  • (6)Authors are the responsible and required to stand by their poster during the core time to encourage discussion with attendees.

Topics of the symposium

Laser Based Dimensional Measurement
Precision Optical Metrology
Active Vision/Metrology
Thin Film Metrology
Ultrafast Laser Metrology
Spectroscopy and Spectral Metrology
Holographic and Speckle Techniques
Laser-Based-Non-Destructive Testing
Shape Measurement / Reverse Engineering
Resolution Enhancement Techniques
Interferometric and Diffractive Methods
Optical Measurement Standards and Calibration

Plenary talks


Scientific metrology versus customer satisfaction: Challenges for the METAS length laboratory
Rudolf Thalmann, Federal Institute of Metrology METAS, Switzerland

As a government funded institute, METAS has the mandate and the mission to best serve the societal and industrial needs. The limited human and financial resources on the one hand and ever more demanding customer requirements on the other hand ask for efficient processes, cost effective services and dedicated research and development with third party funding. It will be shown how the Laboratory for Length, Nano- and Micrometrology at METAS faces the challenge of the sometimes opposing poles of customer satisfaction with a wide range of available services and scientific excellence. In particular the following factors of success will be presented:

  • the large scope of calibration and measurement capabilities resulting in a catalogue of services offered to industrial customers;
  • the processes in place for an effective and efficient customer service provision;
  • proofed equivalence of the national standards and international recognition of the calibration certificates;
  • some economic key figures.

Finally, a selection of unique and in-house developed measurement set-ups, where METAS has gained particular expertise and which are used to a large extent for commercial services, shall be presented, among others photomask measurement, micro-coordinate metrology, form measurement equipment or a universal machine for the calibration of diameter standards.

Biography: Born 1955 in Zürich, Switzerland. 1979 Diploma in Physics (MSc) from the Swiss Federal Institute of Technology (ETH), and 1986 PhD from University of Neuchâtel, Institute of Microtechnology, in Optical Metrology. 1986-1989 post-doctoral research assistant at the University of Neuchâtel working in the field of Interferometry and Optical computing. Since 1989 at the Federal Institute of Metrology METAS in Wabern, Switzerland, working in dimensional and angular metrology. Currently Head of Sector Length, Optics and Time and deputy of the Head of Division Physics and Chemistry. Numerous activities in international committees, among others past chairman of EURAMET Technical Committee for Length and past working group chair within the Consultative Committee for Length CCL.

Liang-Chia Chen

Latest advancesin nano-& micro-scale 3-D surfaceprofilometrictechnologies forin-situ automated optical inspection (AOI)
Liang-Chia Chen,Department of Mechanical Engineering, National Taiwan University

Automated optical inspection (AOI)has become extremely critical for winning success in today’s globally competitive manufacturing world. The AOI technology has beenturned up tremendously essential formodern manufacturing industries like semiconductor, nanotechnology, biotechnology, broadband communication, and opto-electronics.Therefore, our research has aimed to develop enable inspection technologies using various optical measurement principles. It aims to develop novel solutions for in-situ optical inspection on micro 3-D surface profiles and its dynamic characteristics. The methods developed integrate new measuring concepts in chromatic confocal microscopy (CCM), scanning white light interferometry (SWLI), and spectrally-resolve white light interferometry (SRWLI) for measuring 3-D surface characteristics in a high speed and high accuracy manner. Some advanced optical measuring techniques and instrument have also been developed to satisfy the needs. Coherence scanning interferometry (CSI), chromatic confocal microscopy and spectrally resolved chromatic confocal interferometry have been successfullyrenovated into optical measuring instrument with nano-scale resolution in depth and sub-micrometer scale in lateral direction. With rapid increase in application of micro electromechanical systems (MEMS) to industries, the needs of accurate dynamic characterization have also become as a major challenge in design and fabrication. To address this, a dynamic 3-D nano-scale surface profilometer based on SWLI was successfully developed for automatic resonant frequency identification using stroboscopic interferometric principle. Using white-light stroboscopic interferometry, a large depth-of-field measurement of more than 100 micrometers can be easily achieved with a depth detection resolution of 5 nm. Meanwhile, the drawback of in-situ interferometric measurement lies mainly in unacceptable measurement errors caused by potential environmental disturbance such as mechanical vibration and acoustic noises as well as the nonlinearity of the piezoelectric translator (PZT) employed for vertical scanning in SWLI. To resolve the issue, a white-light interferometric measurement method with vibration-resistant capability was developed byemploying in-situ optical detection and closed-loop feedback strategies.The developed fringe-locking method for SWLI vibration resistance has been proved to beeffective in reducing the measurement error, with an improvement of more than six folds when the vibratory frequency is within the satisfactory response bandwidth of the PZT actuator. Moreover, to combine a high measuring range with a good depth resolution, a new nano-scale measurement methodology based on spectrally-resolved chromatic confocal interferometry (SRCCI) was successfully developed by integration of chromatic confocal sectioning and spectrally-resolve white light interferometry (SRWLI) for microscopic 3-D surface profilometry. The one-shot measuring characteristics possessed by the SRCCI method can bring a huge benefit in in-situ automatic optical inspection (AOI) for eliminating undesired negative effects of environmental vibration on measurement accuracy into a minimum.

Biography: Dr. Liang-Chia Chenobtained his Ph.D.in advanced manufacturing and mechanical engineering at the Centre for Manufacturing Research (CAMR), the University of South Australia in 2000. He is currently working as a full professor in the Department of Mechanical Engineering of National Taiwan University, and as an adjunct professor of the University of South Australia. Prior to embarking on his teaching career in Taiwan, he worked as a full-time research engineer in Gerard Industries of Australia for four years and Institute of nuclear energy research (INER) of Taiwan for 5 years. Before joiningNTU, he worked as a full-time distinguished professor in National Taipei University of Technology. His current research interests are automated optical inspection (AOI), opto-mechatronics instrumentation, machine vision and image processing, intelligent systems, automatic optical inspection, reverse engineering for rapid manufacturing. To date, he has published two book chapters, more than 85 referred journal papers and 52 invention patents. He is a member of SPIE, the Institution of Engineers of Australia (IEA), SME and Chinese Institute of Engineers.

Yasuhiro Takaya

Surface analysis based on enhanced Raman scattering by surface plasmon resonance for chemical polishing process using nanomaterials
Yasuhiro Takaya
Department of Mechanical Engineering, Graduate School of Engineering
Osaka University, Japan

Currently, chemical mechanical polishing or planarization (CMP) is widely used in the copper dual-damascene process as a key process technology in manufacturing a greater number of interconnection layers to obtain faster semiconductor devices with high pattern densities. To meet the demand for rapid progress in CMP for the planarization of a copper layer (Cu-CMP) that can achieve planar surfaces with a surface roughness of less than 1 nm RMS, we have developed a novel Cu-CMP technique that uses nanomaterials such as water-soluble polyhydroxylated fullerenes (fullerenol) and polyglycerol-functionalized nanodiamonds (ND-PG). The polishing performances suggested that the chemical reactivity of nanomaterials was an essential factor for the removal of copper. However, the details of the copper-fullerenol/ND-PG interaction are not well understood by post-process surface analyses, because the chemical state of the surface is different during and after processing.
To reveal the material removal mechanism in Cu-CMP process, the chemical reactivity between copper surface and nanomaterials was analyzed based on enhanced Raman scattering by localized and propagating surface plasmon, namely, surface-enhanced Raman scattering (SERS). The new in situ surface analysis method based on SERS was performed to investigate the copper-fullerenol/ND-PG interaction. SERS is a phenomenon in which weak Raman light scattered from molecules is amplified when it contacts with metal nanostructures such as nanoparticles, nanoclusters, gratings, and thin films. When an excitation light is incident upon a glass substrate and copper thin film at an incident angle larger than the critical angle, an evanescent field is localized in the copper layer. By tuning the incident angle to the resonance condition, free electrons are excited, and a propagating surface plasmon resonance is generated in the vicinity of the copper thin film. At this moment, the energy of surface plasmon field decays exponentially on the order of dozens of nanometers. Therefore, strong Raman scattering occurs when a molecule comes in contact with the surface where the strong surface plasmon field exists. In addition, when nanoclusters are formed by proceeding of chemical reaction, enhanced Raman scattering can be obtained by localized surface plasmon resonance.
The proposed in situ surface analysis method based on simultaneous measurement of Raman spectrum enhanced by localized and propagating surface plasmon resonance has great potentialities to enable the surface measurement of chemical conditions with molecular level sensitivity as well as nanostructure. It is a promising measurement technique to explore the novel material removal mechanisms based on the interaction between surface metal and nanomaterial in chemical polishing process.

Biography: Yasuhiro Takaya received PhD. degree in precision engineering from Hokkaido University in 1992. He is working as a professor at Osaka University from 2006.
His research covers topics like laser applied nano-inprocess measurement of surface texture and profiles, laser applied measurement and machining in micromachine production engineering, nano-CMM and fundamental measurement on nanotechnology. Specific outstanding technical engineering accomplishments are follows; (1) Dr. Takaya proposed a new optical measurement method of 3D fine profile, which is based on inverse scattering phase retrieval. He has developed the laser in-process measurement instrument and technology with co-researchers, and has realized 3D fine profile measurement with an accuracy of nanometer order. (2) Dr. Takaya proposed a new microprobe for nano-CMM, which was named ‘Laser Trapping Probe E The principle is based on single-beam gradient force optical trap of a micro-particle used as a probe sphere. He has developed a compact laser trapping probe unit for nano-CMM and performed coordinate measurement of a micropart. (3) Dr. Takaya has some other superior accomplishments on the laser applied nano-inprocess measurement of surface texture based on Fraunhofer diffraction method and evanescent light scattering method, the micro-stereolithography system using LCD mask, nano/micromachining using a micro abrasive grain controlled by optical radiation pressure, 3D cutting edge profile measurement with nanometer resolution for a micro tool.
Dr. Takaya is a member of JSPE, JSME, JSAT, ASPE and CIRP Associate member. He is a winner of György Striker Award at IMEKO World Congress XIV in 1997. He published over 200 papers including proceedings of international conference in the area of nano/micro machining, metrology, measurement and instrumentation in production engineering.

Optional events

Symposium tours

Three bus tours are organized on the last day of the symposium. We look forward to your active participation in the tour.
Please select one tour and register from the registration system.

Optional event registration

The deadline for reservations of symposium tour is July 31, 2014. After the deadline, any reservation cannot be accepted.
(Please note that reservations cannot be made after all the accommodations have reached the set number even if it is before the deadline.)

Symposium Tour 1 (MITUTOYO Utsunomiya course)
Date: Sept. 5, 2014
Tsukuba (8:30) => Mitutoyo Corp., Utsunomiya Operation => Kasama-inari Shrine => Kasama Craft Hills => Tsukuba (17:30)
Registration Fee: Free (Entry fee, Lunch and Bus fare are included.)

MITUTOYO is one of the leading companies of precision measuring product vender. In the tour, we can take a tour of production process of CMM and caliper. After visiting MITUTOYO, Kasama-inari Shrine and Kasama Craft Hills are planed to visit.

Notice: Due to administrative reason, the host may request bus-tour applications to re-book into the other courses at any time before the end of August.

Symposium Tour 2 (Tokyo area course 1)
Date: Sept. 5, 2014
Tsukuba (9:00) => Tokyo Sky Tree (Entry to tower, Lunch time) => National Museum of Nature and Science => (Akihabara Sta. (16:30)) => Tsukuba (18:00)
Registration Fee: Free (Ticket for Tokyo Sky Tree, Visitor fee for National Museum of Nature and Science and Bus fare are included. Lunch is not included.)

We will visit Tokyo Sky Tree. Tokyo Sky Tree is highest broadcasting tower in Japan, which hight is 634 m. To build tall tower in the country which often occeres earthquakes was very difficult, and a lot of new constructing methods were used to build it. We can see and go up the tower. After visiting Tokyo Sky Tree, we will visit National Museum of Nature and Science, which displays collection about nature, life and technologies. Theater360, a 360-degree Movie Theater in the Round, is a big attraction in the museum.

Symposium Tour 3 (Tokyo area course 2)
Date: Sept. 5, 2014
Tsukuba (9:00) => Tokyo Sky Tree (Entry to tower, Lunch time) => Asakusa (Free time) => (Akihabara Sta. (16:30)) => Tsukuba (18:00)
Registration Fee: Free (Ticket for Tokyo Sky Tree and Bus fare are included. Lunch is not included.)

We will visit Tokyo Sky Tree. Tokyo Sky Tree is highest broadcasting tower in Japan, which hight is 634 m. To build tall tower in the country which often occeres earthquakes was very difficult, and a lot of new constructing methods were used to build it. We can see and go up the tower. After visiting Tokyo Sky Tree, we will visit Asakusa area, where we can feel old-Japanese air.

Young researcher's meeting

We would like to invite young researchers to join the LMPMI2014 Young Researcher Meeting. Please build up a network of young researcher's connections.
The applicant has to be under age 40.

Time: September 3rd, 2014. 6:30-8:30pm
Location: Dayz Town (a few minute walk from the International Congress Center)
Meeting fee: 4,000 JPY

*This meeting is organized in cooperation with the JSPE Research Affiliates (young researcher's association).

Please register from registration system.

Young researcher’s meeting  registration

The deadline for reservations of young researcher's meeting is August 22, 2014.

Important Dates

On-line registration:
August 22,2014
Symposium tour registration:
July 31, 2014
Early registration:
June 30, 2014
Proceedings deadline:
May 31, 2014

Web Page Download

11th IMEKO Symposium
LMPMI 2014 PDFpdf

organized by

Intelligent Nano-Measure

Technical Committee for Intelligent Nano-Measure, JSPE


National Metrology Institute of Japan(NMIJ, AIST)

In association with


International Measurement Confederation (IMEKO) Technical Committee TC14 Measurement of Geometrical Quantities, IMEKO

In cooperation with


The Japan Society for Precision Engineering (JSPE)


Japan Optical Measuring Instruments Manufacturers Association


Japan Precision Measuring Instruments Manufacturers Association


JSPE Research Affiliates

Supported by

NSK Foundation for the Advancement of Mechatronics (NSK-FAM)

The Precise Measurement Technology Promotion Foundation

Tsukuba Tourist and Convention Association

Tsukuba EXPO' 85 Memorial Foundation


The New Technology Development Foundation